MATHEMATICAL MODEL OF THE INFLUENCE OF GRAIN BOUNDARY SLIDING ON THE PROCESS OF HIGH-TEMPERATURE DEFORMATION OF SILICON NITRIDE-BASED CERAMICS
DOI:
https://doi.org/10.34185/1991-7848.itmm.2023.01.032Keywords:
silicon nitride, deformation, deformation mechanism, grain boundary slipAbstract
The speed of direct high-temperature extrusion of ceramics based on silicon nitride was analyzed. The influence of grain boundary slip and viscous flow of the intergrain phase on mass transfer processes and deformation rate is established. The influence of the parameters of the high-temperature deformation process on the deformation rate is shown. An equation is proposed that describes the effect of grain boundary slip and viscous flow of the intergranular phase on the strain rate. The described equation of strain rate can be used to create technological processes of plastic deformation of ceramic materials.
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