MODEL OF THE EFFECT OF STRESS STATE ON THE GROWTH OF ELONGATED GRAINS β–Si3N4 DURING HIGH-TEMPERATURE DEFORMATION OF SILICON NITRIDE-BASED CERAMICS
DOI:
https://doi.org/10.34185/1991-7848.itmm.2026.01.027Keywords:
silicon nitride, deformation, stress state, deformation mechanism, growth of elongated grainsAbstract
The structures of ceramic materials of known compositions based on silicon nitride with high (Si3N4-5wt.%Y2O3-5wt.%Al2O3), medium (Si3N4-5wt.%Y2O3-2wt.%Al2O3) and low (Si3N4-2wt.%Y2O3-1wt.%Al2O3) content of sintering activators after high-temperature deformation according to the direct extrusion scheme were analyzed. An increase in grain size and an increase in the number of anisometric grains in the structure of the deformed material were recorded, with the vast majority of anisometric grains being located coaxially with the longitudinal axis of symmetry of the matrix. The stress state in the deformation zone is considered. The influence of the stress gradient in the deformation zone on mass transfer processes is shown. The mathematical model of the influence of the stress state on the growth of elongated β–Si3N4 grains in an inhomogeneous stress field in the transition cone of the matrix is considered.
References
Kryl Y.A., Dutka V.A., Isakov A.A. Study of the temperature field during hot pressing of silicon nitride blanks // Superhard materials.-1993.-№ 4.-P.22-23.




